Announcing a Special Issue of the
IEEE Transactions on Plasma Science
on Electrical Discharges in Vacuum
(Scheduled for August 2009)

The XXIII-rd International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV 2008) was held on September 15~19, 2008, in Bucharest, Romania (www.isdeiv2008.ro). The ISDEIV is an interdisciplinary forum in the field of electrical discharges and insulation in vacuum, which brings together the representatives from theoretical Science, R&D and Industry. The papers presented reflect the most recent developments on the physics and technology of electrical discharges in vacuum and their applications. The exchange of scientific results, the discussions of ideas and new challenges offered good opportunities of progress in this field of activity.

The full journal manuscript must not be identical to the proceedings manuscript, but substantially revised and lengthened. They must be prepared following the style requirements of IEEE Transactions. There will be no pre-selection process.  In the interest of representing the full spectrum of activities in the field, it is permissible that submission to the Special Issues include contributions that were not presented at the symposium provided those contributions fit well to the topics of the Call for Papers: 

A: Breakdown and Flashover

1. Vacuum breakdown and pre-breakdown phenomena
2. Surface discharges and flashover phenomena

B: Vacuum arcs

1. Vacuum interrupters and their applications
2. Switching in vacuum and related phenomena
3. Extremely High Current Vacuum Arc and Interruption Process
4. Interaction of vacuum arc with magnetic field
5. Vacuum arc physics
6. Modeling and computer aided design of VCB and others

C: Applications

1. Surface modification and other plasma applications
2. Electron, ion, neutron, X-ray and other light sources
3. Accelerators and fusion reactor related issues
4. Space related technologies

D: Surface Science and Vacuum Microelectronics

1. Surface Science and Applications
2. Vacuum microelectronics and their applications

The manuscript submission deadline is November 1st, 2008.

All contributions should be submitted electronically through the IEEE Manuscript Central web site at: http://mc.manuscriptcentral.com/tps-ieee as described in the submission instructions www.ieee.org/pubs/authors.html. All papers will undergo standard peer-review process typical for all IEEE Transactions and Journals.

Please direct questions to the Guest Editor for this Special Issue:

Prof. Dan Pavelescu
University “POLITEHNICA” of Bucharest
Electrical Engineering Department
313 Splaiul Independentei
Bucharest 060042, Romania
Phone/Fax: +4021 3169646; +4021 3464933
E-mail: dpavelescu@icpe.ro; pavelescu_eltech@yahoo.com